Holitech vigorously develops automated production and high-end product development and innovation, makes every effort to enhance the strength of intellectual manufacturing, builds a multi-level R&D system on all fronts, rapidly lays out the frontier fields of biometrics, big data, smart cars, and smart home, and focuses on providing customers with high-precision, high-performance, high-value camera and biometric product solutions.
Camera Module
Biological Recognition
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：64 million
Chip Size：1/1.72 inch
F.No：1.89
Field of View：D 80°
Module Size：11.35*11.9*6.63mm
Applications：Smart Phones/Tablets Rear Main Camera
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
Pixel Size：1.75um
F.No：2.4
Field of View：D 88.8°
Module Size：5.7*6.0*3.15mm
Applications：Smart Phones/Tablets Secondary Camera DOF
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/4.4 inch
F.No：3.4
Field of View：D 19.6°
Module Size：13.25*20.67*5.63mm
Applications：Smart Phones Secondary Camera 5x Optical Zoom
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：5 million
Chip Size：1/5 inch
F.No：2.2
Field of View：D 120°
Module Size：6.5*6.5*4.48mm
Applications：Smart Phones/Tablets Secondary Camera Wide Angle Application
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：80 thousand
Chip Size：1/3 inch
F.No：1.3
Field of View：D 87.8°
VCSEL Field of View： 60°
Depth Accuracy：1% or less
Module Size：9.5*21.0*6.35mm
Applications：Smart Phones/Tablets Secondary Camera 3D Distance Measurement, Smart Locks
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.4
Field of View：D 85°
Focusing Distance：4cm
Module Size：6.02*6.06*2.725mm
Applications：Smart Phones/Tablets Secondary Camera Ultra-macro
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/7.5 inch
F.No：2.0
Field of View：D 90°
Module Size：7.3*7.3*3.55mm
Applications：Smart Phones/Tablets Secondary Camera Miniaturization Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：1.7
Field of View：H 123°/ V 67°
Output Format：LVDS
Module Size：25*25*28.6mm
Applications：Cars Front and Rear Camera
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：2.0
Field of View：H 183.2°/ V 142.8°
Output Format：AHD
Module Size：25*25*23.96mm
Applications：360° Panoramic Image
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/3.55 inch
F.No：2.05
Field of View：H 125°/ V 82.5°
Output Format：LVDS
Module Size：23*23*26.85mm
Applications：Rearview Parking Image
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/4 inch
F.No：2.5
Field of View：H 66°/ V 40°
Output Format：AHD
Module Size：76*40*29mm
Applications：940nm Infrared Driver Facial Identification Monitoring
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/2.9 inch
F.No：2.2
Field of View：H 139°/ V 76°
Output Format：LVDS
Module Size：50*28*29mm
Applications：In-vehicle Passenger/Living Being Identification Monitoring
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/1.73 inch
F.No：1.8
Field of View：H 124°/ V 65.6°
Output Format：LVDS
Module Size：30*30*45.8mm
Applications：Safety Assisted Driving Images
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/3.55 inch
F.No：2.05
Field of View：H 125°/ V 82.5°
Output Format：LVDS
Module Size：23*23*26.85mm
Applications：Side Blind Spot Monitoring
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：2.0
Field of View：H 123°/ V 67°
Output Format：AHD
Module Size：25*25*26mm
Applications：Rearview Parking Monitoring Camera
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/7.5 inch
F.No：2.0
Field of View：D 166.5°
Module Size：6.4*6.4*5.466mm
Applications：6DOF Event Camera
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：32 million
Chip Size：1/2.8 inch
F.No：2.2
Field of View：D 159.3°
Module Size：8.85*8.85*6.5mm
Applications：Vision HD Video
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：80 thousand
Chip Size：1/3 inch
F.No：1.3
Field of View：D 87.8°
VCSEL Field of View：60°
Depth Accuracy：1% or less
Module Size：9.5*21.0*6.35mm
Applications：Depth Camera
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1.3 million
Chip Size：1/4 inch
F.No：6.15
Field of View：D 50°
Scanning DOF：4cm~86.8cm
Module Size：6.5*6.5*6.85mm
Applications：Mobile Terminal Large Depth of Field QR Code Scanning
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：13 million
Chip Size：1/3 inch
F.No：2.2
Field of View：D 81.2°
Module Size：8.5*8.5*4.25mm
Applications：Mobile Terminal Auto-focus 2D Code Scanning
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Chip：ET8EH1-S-8Z（TOSHABA CCD Linear Image Sensor）
Pixels：1500
F.No：1.0
Module Size：23.7*7.5*10.44mm
Applications：Handheld Scanning Gun Linear 1D Code Scanning
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1 million
Chip Size：1/10 inch
F.No：2.2
Field of View：D 72°
Module Size：70*5.5*2.485mm
Applications：Notebook HD Video
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.0
Field of View：D 82.7°
Module Size：75.8*3.1*2.375mm
Applications：Notebook UHD Video
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/10 inch
F.No：2.0
Focusing Distance：1.45cm
Field of View：D 85.1°
Module Size：38*φ4.1mm
Applications：Medical Endoscope
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/2.8 inch
F.No：2.0
Field of View：D 100.6°
Module Size：29*20*11.75mm
Applications：Video Conference
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.2
Field of View：D 146.5°
Module Size：28*52*12mm
Applications：IoT Smart Refrigerator Application
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1 million
Chip Size：1/4 inch
F.No：1.8
Field of View：D 100°
Module Size：36*36*10mm
Applications：3D Printer
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